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KG-12” 3D Tin ball sheet Wafer
KG-12” 3D Tin ball sheet Wafer
Purpose: The purpose of this document is to generally describe the wafer design and function.
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Description
1.Wafer Introduction
Wafer Size: 12”
Substrate Thickness: 775µm
Substrate Type: P-type lightly doped
Packaging: Single wafer box vacuum sealed packaging
2. Territory
3. Actual measurement images
4. Specifications
Feature Products
Visual Check: Cross-section
Visual Check: De-capsulation
Visual Check: AOI
Equipment Name :SAT (Scanning Acoustic Microscope)
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KG-12” 3D Tin ball sheet Wafer
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