Leveraging university R D teams, we specialize in non-standard micro-nano processes, developing tailored processes for MEMS devices, advanced packaging, and customized metrology standard wafers. This overcomes the limitations of standard production lines, adapting to research samples and small-batch pilot production.
We provide a comprehensive one-stop service, handling the entire process from process design to layout optimization, wafer fabrication, thin film processing, etching, ion implantation, wafer-level packaging, and precision testing and analysis. This reduces outsourcing costs and timelines for our clients.
We support 4/6/8/12-inch silicon wafer processing, compatible with silicon-based and specialty compound substrates. We flexibly handle small research orders and large-scale enterprise production orders, with flexible capacity allocation.
Equipped with a full range of inspection equipment, including SEM, thickness gauges, optical defect analyzers, and probe electrical testing equipment, we provide end-to-end process control, finished product inspection, and failure analysis. This allows for rapid defect identification and steady improvement in yield. 5. Advantages of rapid project implementation: High efficiency in process iteration, short sample prototyping cycle, and rapid adjustment of process parameters can shorten the time from R D to mass production for customer products.
High efficiency in process iteration, short sample prototyping cycle, and rapid adjustment of process parameters shorten the time from R D to mass production for customers.
