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Home > Products > Reliability and Failure Analysis Services > Equipment Name :X-ray（CT）
  • Equipment Name :X-ray（CT）,Suzhou Xingyao Microelectronics,Equipment Name :X-ray（CT）
  • Equipment Name :X-ray（CT）,Suzhou Xingyao Microelectronics,Equipment Name :X-ray（CT）

Equipment Name :X-ray（CT）

Main Test Items:

1.Solder void inspection BGA/CSP
2.BGA/CSP solder ball defect inspection
3.Internal cold solder joint, open‑circuit & short‑circuit inspection
4.Wire bond integrity inspection
5.Via /underfill filling rate inspection

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  • Equipment Name :X-ray（CT）,Suzhou Xingyao Microelectronics,Equipment Name :X-ray（CT）

Description

Inspection Images：

Feature Products

Visual Check: Cross-section

Visual Check: Cross-section
Visual Check: De-capsulation

Visual Check: De-capsulation
Visual Check: AOI

Visual Check: AOI
Equipment Name :SAT (Scanning Acoustic Microscope)

Equipment Name :SAT (Scanning Acoustic Microscope)

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Equipment Name :X-ray（CT）

Equipment Name :X-ray（CT）
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