1.Wafer Introduction
Wafer Size: 6” & 8”
Substrate Thickness: 725um
Substrate Type: P-type lightly doped
Packaging: Single wafer box vacuum sealed packaging
2. Layout
Features XY horizontal tracking lines with clearly visible tracking symbols for easy visual identification, facilitating automatic coarse positioning of the machine along the X and Y axes.
Central groove dimensions: 1*4mm. Fine positioning symbols are located on both sides of the groove. This can be used for precise measurement positioning and leveling.
3.Specification
